Connecting technologyDriving innovation
From glass materials, TGV and RDL to pilot manufacturing and AI engineering compute — a technology platform built for next-generation high-performance computing.
COMPANY PROFILE · EST. 21 APR 2017
Founded on 21 April 2017 in Singapore, FUTENG is a semiconductor industry service and R&D company providing equipment, materials, technical consulting and training. We are developing glass-based advanced packaging, with phased AI computing infrastructure as an independent strategic expansion.
TECHNOLOGY DRIVES INDUSTRY · EMPOWERING A SMARTER FUTURE
Explore key packaging approaches for high-performance computing, from chiplet interconnects and vertical stacking to thermal design.
01 · 2.5D
An interposer connects multiple chiplets and integrates them with a package substrate, forming a chiplet–interposer–substrate structure.
02 · 3D
Chips are integrated vertically, using microbumps or hybrid bonding to create interconnections between layers.
03 · 3.5D
Combines 3D chip stacking with 2.5D packaging, bringing vertical integration and lateral interconnects into one package.
04 · THERMAL
Combines high-thermal-conductivity materials with microchannel cooling structures across chips, lids and their interfaces.
These descriptions introduce technology approaches. FUTENG’s glass-based process platform and product roadmap follow below.
From materials to systems: an advanced process platform for HPC, heterogeneous integration and co-packaged optics.
Built on glass materials and panel-level processing, from process validation to product introduction.
Multi-die interconnect for AI/HPC, HBM, chiplets and advanced packaging.
For high-density packaging and large-format substrates.
For CPO, silicon photonics and electro-optical integration.
High-performance, high-reliability packaging and interconnect for LLM training and inference.
High-density, reliable packaging and interconnect for next-gen AI accelerators.
Multi-die integration that lifts system performance and design flexibility.
High-speed interconnect and opto-electronic integration for data and compute.
Advanced packaging and interconnect for efficient, stable data-center infrastructure.
Rugged, high-reliability packaging for smart vehicles and industrial equipment.
MORE COMPUTE. A SMARTER TOMORROW.
Planned for Malaysia as an independent commercial project alongside glass-based manufacturing. The four-stage roadmap targets 256 servers cumulatively, with investment and deployment aligned to customer demand.
Initial capacity, subject to project readiness
Expand capacity with validated demand
Scale with business development
Long-term deployment target
Planning targets, not installed capacity. The specific IDC location and hosting provider remain to be selected. GB300 is a provisional reference; final equipment, timing and scale depend on procurement configuration, quotations, compliance and project progress.
From materials to industrialization, engineering capability that connects technology and industry.
A closed engineering loop: material → TGV → metallization → RDL → reliability.
Developing a pilot platform for engineering validation and customer qualification.
Experts in process, equipment, IC design, materials and industrialization.
Simulation, process data, yield models and AI optimization.
Experience across international business management, semiconductor process, advanced packaging, equipment, IC design, materials, manufacturing and industrial capital.
Dr. Alex Zheng holds a DBA and specializes in semiconductor process R&D, operations, and corporate strategy. He has held leadership roles at SMIC, TSMC, and A*STAR's Institute of Microelectronics, and serves as Vice President of Sari Technology and Chairman of the Board of Futeng Technology in Singapore.
An international defense trade professional with expertise in oil and gas, artificial intelligence, and cybersecurity. He brings extensive experience in international business management, leading research and development teams, and investment, and also serves as a political advisor.
Bryan Hung specializes in semiconductor equipment development and maintenance, production management, and manufacturing process optimization. His experience spans equipment R&D and factory management, with current work focused on semiconductor packaging materials and process waste recycling.
Joe Hung specializes in LED and MicroLED display technologies, advanced semiconductor packaging, and process materials. He has held management roles in Foxconn's display and semiconductor businesses and is a founding shareholder of GPTC and founder of Tech-point in Taiwan and Singapore.
Dr. Dongsheng Yang holds a bachelor's degree in physics from Tsinghua University and a Ph.D. in solid-state and nuclear physics from Rutgers University. His semiconductor R&D and management experience includes roles as Distinguished Member of Technical Staff at Bell Labs, Executive Vice President at Grace Semiconductor, and Chief Scientist at Chongqing Liangjiang Semiconductor Research Institute.
Benson Wang specializes in LED displays and lighting manufacturing. His expertise includes production process planning in these fields.
Dr. Fred Huang holds a Ph.D. in physics from Southern Methodist University and an Executive MBA from Stanford University, with expertise in semiconductor technology, corporate strategy, and venture capital. He has served as CEO of BCD Semiconductor, led Varian's semiconductor business, and held partner roles at Yihe Venture Capital Group and Wuxi Yihe Guolian Investment Management.
Derrick Qiu holds master's degrees in intellectual property and accountancy, with expertise in semiconductor and optoelectronic materials, intellectual property management, and corporate finance. He serves as Founder and General Manager of Hefengding Industrial and General Manager of Shuwei Industrial, and previously served as Vice President at HSBC Singapore.
Luke Lu specializes in integrated circuits and advanced packaging. His expertise also includes semiconductor supply chain management.
Ying Shiao specializes in IC design and manufacturing, display technologies, and advanced semiconductor packaging, with experience in wafer fabrication and supply chain management. Previously Vice President of Operations at eMagin, Ying Shiao serves as Vice President at Operation Fast Power Corporation, overseeing IGBT power semiconductor design and manufacturing.
We welcome strategic investors, industry partners and key customers to advance validation, deployment and commercialization together.
Connecting technology and industry
Empowering a smarter future
